AIM V9 SAC305 T4 No Clean Lead Free Solder Paste (10 jars)
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Pay with a Purchase Order
As part of our payment options, we gladly accept purchase orders. However, it is important to note that setting up terms with Starboard Technologies is necessary. To request the required information, please email us at rubin@starboardtech.com or make use of our user-friendly online submission form.
Are you looking to eliminate voids?
New AIM V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily pin-probed and has high SIR values.
- Low Voiding: as low as 1% on BGA and <5% on BTCs
- Capable of Consistent Printing with Area Ratio < 0.66
- High Reliability (SIR)
- Drop-in for M8
- REACH and RoHS* Compliant
- Available in SAC305 T4
- Evaluation samples are available. Contact us for details.