AIM Solder Products

Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4...

AIM NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability o...

AIM NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print def...

AIM NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print def...

AIM NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print def...

NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print defini...

NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print defini...

AIM NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now m...

AIM NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now m...

The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS com...

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved prin...

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved prin...

A single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. For Printing and Dis...

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Availab...

A saponifier formulated to readily remove resin, rosin, no clean, and water soluble flux residues from printed circuit boards while preventing the ...

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free so...

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that result...

AIM DJAW-10 understencil wipe solvent is compatible with all AIM no clean and water soluble solder pastes. DJAW-10 is formulated for hand applicati...

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA ...

AIM FX16 No Clean Flux has been engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, eve...

GLOW CORE is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues. Tin-Lead and Lead-Free Compati...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...