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THE INTERNET'S BEST SOURCE FOR ELECTRONIC REPAIR AND ASSEMBLY TOOLS & SUPPLIES
BEST SOURCE FOR ELECTRONIC REPAIR AND ASSEMBLY TOOLS & SUPPLIES

Now Accepting Purchase Orders as a form of Payment - Apply Today

Now Accepting Purchase Orders as a form of Payment - Apply Today

AIM NC520 SN63/PB37-T4 No Clean Solder Paste, 700 Gram Cartridge (10 jars)

AIM NC520 SN63/PB37-T4 No Clean Solder Paste, 700 Gram Cartridge (10 jars)

MPN: 89186

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As part of our payment options, we gladly accept purchase orders. However, it is important to note that setting up terms with Starboard Technologies is necessary. To request the required information, please email us at rubin@starboardtech.com or make use of our user-friendly online submission form.

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AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.

Features:
- For Use with Demanding High Density Electronic Assemblies
- Reduced Head-in-Pillow
- Extremely Stable Formula
- Extended Pause-to-Print Process Window
- Reduces Voiding on QFN Ground Pads
- Improved Printing Characteristics

Technical Data Sheet
SDS

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.

Features:
- For Use with Demanding High Density Electronic Assemblies
- Reduced Head-in-Pillow
- Extremely Stable Formula
- Extended Pause-to-Print Process Window
- Reduces Voiding on QFN Ground Pads
- Improved Printing Characteristics

Technical Data Sheet
SDS

If you have a questions, call us at 321.676.3711 or

Contact information

Sales assistance concerning a product or solution for you or your business:

Starboard Technology

115 E. New Haven Avenue, Melbourne, FL 32901 Phone: (321) 676-3711 /Fax: (321) 676-3171

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