Solder Bar, Flux, Paste & Wire

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that result...

SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free so...

GLOW CORE is a lead-free and tin-lead compatible no-clean flux core that offers very good wetting and low residues. Tin-Lead and Lead-Free Compati...

NC258 Solder Paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions. NC258 Solder Paste reduce...

NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and valida...

NC257-2 Lead-Free Solder Paste improves every aspect of lead-free soldering, increasing the throughput of the most advanced SMT applications. NC25...

NC254 is a lead-free and tin-lead compatible solder paste that offers very good wetting, clear residues and has shown to eliminate voiding under mi...

NC217 Gel Flux is designed for touch-up and repair work where the flux may spread away from the heat source. NC217 Gel Flux is electrically safe e...

Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA ...

A saponifier formulated to readily remove resin, rosin, no clean, and water soluble flux residues from printed circuit boards while preventing the ...

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Availab...

A single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. For Printing and Dis...

Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4...