Lead Free Solder and Flux

AIM WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates....

AIM WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates....

AIM WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates....

AIM WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates....

Are you looking to eliminate voids? New AIM V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications...

AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all soldera...

AIM RMA258-15R is a rosin based solder paste that has been developed to offer long pause-to-print capabilities while enhancing fine print definitio...

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved prin...

AIM NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now m...

AIM NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now m...

AIM NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print def...

NC258 No Clean Solder Paste has been designed to offer one of the longest pause-to-print windows in the industry while enhancing fine print definit...

AIM NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability o...

AIM NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability o...

AIM NC257-2 has been developed to offer extremely broad process windows for printing, wetting and pin-probe testing. The superior wetting ability o...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM M8 no clean solder paste is designed for the most demanding high density electronic assemblies. An evolution of the highly successful NC258 pla...

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved prin...

AIM NC259 is a low-cost, lead-free halogen-free solder paste that offers the performance of tin-lead and high-silver lead-free solder pastes. Now m...

The revolutionary activator system in AIM's new NC273LT low temperature solder paste improves the wetting performance of bismuth alloys to RoHS com...

AIM NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved prin...