Aim 688 One-Step Underfill (10 Units)

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by AIM Solder Products

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Pay with a Purchase Order

As part of our payment options, we gladly accept purchase orders. However, it is important to note that setting up terms with Starboard Technologies is necessary. To request the required information, please email us at rubin@starboardtech.com or make use of our user-friendly online submission form.

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.

Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues Odorless During Printing and Curing Flux Action to Make Solder Connections Non-Hygroscopic Reworkable Good Storage Properties No Voiding Cures in Lead-Free Profile .
TDS
MSDS

Description

A non-odorous, low surface tension, one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and uBGA assemblies. Available in industry standard sizes.

Excellent Capillary Function for Fast Reflow Compatible with No-Clean Flux Residues Odorless During Printing and Curing Flux Action to Make Solder Connections Non-Hygroscopic Reworkable Good Storage Properties No Voiding Cures in Lead-Free Profile .
TDS
MSDS

Specifications & Info

Contact information

Sales assistance concerning a product or solution for you or your business:

Rubin Slyper, Sales/Marketing, 321/676-3711 or 321-432-2200 rubin@starboardtech.com
Fergus Daly, Sales, 321-676-3711 or 321-499-0010 fergus.daly@starboardtech.com
Julie Edwards, Sales, 321-676-3711 julie@starboardtech.com
Heather Short, Purchasing, 321-676-3711 heather@starboardtech.com
Kim Maestri, Accounting/Marketing, 321-676-3711, kim@starboardtech.com

Starboard Technology

115 E. New Haven Avenue, Melbourne, FL 32901 Phone: (321) 676-3711 /Fax: (321) 676-3171

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