Aim FF35 Underfill (10 Units)
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As part of our payment options, we gladly accept purchase orders. However, it is important to note that setting up terms with Starboard Technologies is necessary. To request the required information, please email us at rubin@starboardtech.com or make use of our user-friendly online submission form.
- Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.