Hakko FR-1418 BGA System (Manual Z-axis)
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SPECIFICATIONS
| Part Number | FR1418-01 |
| Power Consumption | 120 VAC, 15A |
| Preheater, low mass IR | 750W Single Zone 254 x 305 mm (10 x 12 inch) Proportional control 20-100% |
| Top Heater, forced convection hot/gas | 1000W |
| Dimensions | 711 x 711 x 711 mm (28 x 28 x 28 inch) |
| Weight | 57 kg (125 lbs.) |
| Supply Air | 483 kPa (70 PSI) 5 CFM (Dry, Filtered) 1/8 inch NPT female inlet 3/8 inch (10mm) min. |
Standard Accessories Pack
| Qty | Part Number | Description |
| 2 | 222-510 | Bottom IR Heater Lamp 500W |
| 3 | 222-512 | Type K 36 Ga. Thermocouple |
| 1 | 222-513 | Standard Vacuum Cup 0.28 Dia. |
| 1 | 222-514 | Optics Calibration Tip |
| 1 | 222-515 | Optics Calibration Plate |
| 1 | 222-528 | HMI Software |
| 1 | n/a | HMI Workstation CPU |
| 1 | n/a | Flat Panel Monitor for HMI Workstation |
| 1 | n/a | Video capture card for HMI Workstation |
Part Number: FR1418-02
The Hakko FR-1418 BGA Rework System is constructed of heavy-walled aluminum castings for unsurpassed precision and stability and uses precisely controlled solder reflow profiles. The system features a unique gantry style construction similar to that of a pick-and-place machine, which allows the PCB to remain stationary while the head moves to accomplish the X, Y, Z and Theta alignment.
The Z-axis travel and component placement is manually controlled. The bottom heater is a dual zone (12 x 20 inches) large area, low mass infra-red heater that provides fast, efficient heating and eliminates board warping.
  | GANTRY SYSTEM • Unique gantry system allows the PCB to remain stationary while the head is manually moved to accomplish the X, Y, Z and Theta alignment. • The design allows the capacity to rework boards up to 14 x 18 inches in a smaller footprint with simple board fixture. • Rigid structure for stability and accurate component placement • Rapid movement handle allows fast, easy X-Y alignment along smooth motion gantry • Fine adjust with fine-threaded adjustment knobs |
 | BOARD and COMPONENT CAPACITY • Board capacity: 2 x 2 inch minimum, 14 x 20 inch maximum (larger board sizes possible) • PCB thickness up to 0.25 inch (6.4 mm) • Able to remove components up to 1.5 in. tall • Component sizes: 0.08 inch (2.0 mm) square minimum, 2 inch (51 mm) square maximum • Able to handle both grid array and leaded-typed components (BGA, CGA, QFP, LCC, TSOP and many others.) • Placement accuracy to +/- 0.002 inches • Fully adjustable PCB holding fixture standard |
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CONTROL SYSTEM |
| | 1000W TOP HEATER • Forced convection hot gas system • Heater head with built in vacuum pick-up and Theta adjustment • Various interchangeable vacuum tips and cups available • Low, medium, and high gas flow |
| LOW MASS INFRARED PREHEATER • Large area, low mass infra-red heaters provides fast, efficient heating and eliminates board warping • Standard: 750W single zone IR array (10x12") • Optional: 1500W single zone High Density IR array (10x12") • Optional: 1500W dual zone IR array (12x20") • Optional: 3000W 240V two zone High Density IR array (12x20") • True proportional control (0-100% power) |
  | FOUR (4) THERMOCOUPLE INPUT PORTS • Real-time process monitoring and development • TEACH, BOARD and two SPARE thermocouples • Control system graphs thermocouple temperatures |
 | OPTICS • Beam-splitting prism allows LookUp/LookDown vision with LED lighting • Top and bottom lighting independently adjusted • Optional Pan and Tilt mirror allows zoom in and scanning of image |
| CCD VIDEO CAMERA • Color camera with fixed mirror • Focus, zoom and aperature control |
